Home > Newly Shipped PCB > F4BTM300 2-Layer 10mil Ceramic-Filled PTFE PCB with ENIG Finish

F4BTM300 2-Layer PCB
PCB Material:F4BTM300 / 10mil (0.254mm)
MOQ:1PCS
Price:1.99-89 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:5-8 working days
Payment Method:T/T, Paypal
 

F4BTM300 2-Layer 10mil Ceramic-Filled PTFE PCB with ENIG Finish


1.Introduction

The F4BTM series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.


These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.


Furthermore, F4BTM laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.


2.Key Features

Dielectric constant (Dk) of 3 +/-0.06 at 10GHz
Dissipation factor of 0.0018 at 10GHz, 0.0023 at 20GHz
CTE x-axis of 15 ppm/°C, CTE y-axis of 16 ppm/°C, CTE z-axis of 72 ppm/°C, ranging -55°C to 288°C
Low thermal coefficient of Dk at -75 ppm/°C, ranging -55°C to 150°C
Moisture absorption of 0.05%
UL-94V0


3.Benefits

Enhanced dielectric constant and thermal performance with nano-ceramic fillers
Improved heat resistance and reduced thermal expansion
Higher insulation resistance and thermal conductivity
Low loss characteristics maintained
Excellent PIM performance with RTF copper foil
Precise line control and reduced conductor loss


F4BTM300 PCB


4.PCB Details

Specification Value
Base MaterialF4BTM300
Layer Count2 layers
Board Dimensions112mm × 89mm (±0.15mm)
Minimum Trace/Space4/5 mils
Minimum Hole Size0.4mm
Blind ViasNo
Finished Board Thickness0.3mm
Finished Cu Weight (Outer Layers)1oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishENIG (Electroless Nickel Immersion Gold)
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskBlack
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
F4BTM300 Core – 0.254 mm (10mil)
Copper layer 2 – 35 μm


6.PCB Statistics

Components: 29
Total Pads: 106
Thru Hole Pads: 73
Top SMT Pads: 33
Bottom SMT Pads: 0
Vias: 26
Nets: 2


7.Typical Applications

Aerospace equipment, space and cabin equipment
Microwave, RF
Radar, military radar
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications, and more


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

Get a Quick Quote

Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for F4BTM300 2-Layer 10mil PCB.

No file chosen

Max 10MB/file: .zip, .pdf, .jpg, .png, .txt (multiple)

Your information is safe. We'll respond within 24 hours.

Previous TP600 2-Layer 19.6mil High-Frequency Thermoplastic PCB with ENEPIG Finish

Next CLTE-AT 2-Layer 5mil Ultra-Thin Ceramic PTFE PCB with Immersion Gold